Nowadays, the computer technology develop very fast, so does the CPU, the CPU needs to run faster and faster; the faster a given CPU runs, and the higher its supply voltage, the more heat it emits. If the cooling thingy attached to the top of the chip can't dissipate that heat well enough, the CPU will get too hot and stop working. Therefore improving the heat dissipating is the big technique problem we facing now. 　　There are several ways to improve the heat dissipating, such as: using a bigger heat sink, choosing a good fan with higher speed, increasing the dissipating area of heat sink, and applying better materials. However, all these methods are not satisfied.
　　Applying the TE modules on the CPU cooling, now is not a completely mature technology, but after long-term's experiments and research, people have make a good progress on this technology. Using the technology, you can follow the below steps.
　　The refrigerating features of TE modules: please see the cooling features
TE modules have lots of applications, such as: portable refrigerator, water dispenser and so on. Please see details in Application.
　　Take TEC1-12708 for example: its rated voltage is 12 V, the maximum current is 8A, the maximum DT can reach 68oC, the dimension is 40*40*3.6mm; and the cooled CPU is the P4 chip of Intel.
　　Installation
　　It is very easy to install the TE modules. Before installation, you'd better prepare some conducting-heat silicon resin, then you should know which side is the hot side and which is the cold side, so you can do a test described in Ways of using, and remember the hot side and the cold side.　
　　When you install the TE modules, first daub the both sides with a layer of conducting-heat silicon resin, and then insert the TE module between the heat sink and the CPU; it's better to add a sheet metal with high thermal conductivity between the cold side and CPU, the size of the metal should be the same as the TE module, its thickness is 1-2mm, thus can got a better dissipating efficiency; the hot side should be connected to the heat sink, and on the top of the heat sink, there should be a high-power fan; at last use some special fastener to fix them. 　After fixation, please connect the power supply with the TE module and the fan (be care about the polarity), the voltage of the power supply should be 5V, not 12V, and otherwise it will damaged the CPU because of low heat dissipating power; the power supply of the computer chassis should be 300W, if the power of computer chassis is less than 230W, it should be connected with external DC power supply, otherwise the computer can not work normally.
　　Note
　　1 The heat dissipating of the hot side
　　The temperature of the hot side should not be overhigh, if the temperature is too high; maybe the heat dissipating ability of the heat sink is not enough. Under the rated operating voltage, normal fan cannot supply sufficient heat dissipating ability for TE modules, so the TE modules are easily get damaged. The TE modules cannot work without a fan for a long time, or it will be damaged because of high temperature. 　　2 The knot dew phenomenon
　　When the temperature drops to a certain extent, the knot dew phenomenon may come out, the phenomenon is related to the temperature and humidity (that is the "dew point" of aerography). However this phenomenon cannot happen in the computer chassis, the better way is to keep the operating temperature of the cold side around 20℃, we can keep the temperature by adjusting the voltage of TE module or the speed of the fan.
　　3 The power of the computer power supply
　　The power of the TE modules can reach 60W; this will cause some problems if the computer power supply is not good enough. The computer power supply has two kinds of power supply: one is 5V (the current can be more than 20A), the other is 12V(the current just around 6A). It's better to apply the 5V power supply, or you can use external power supply.
　　4 The heat dissipating of the computer chassis
　　Obviously, when the TE modules transferring the temperature of the CPU, the hot side of the TE modules will dissipate plenty of heat, so the temperature of the computer chassis will increase, the work of the other parts will be influenced. Therefore, should pay attention to the heat dissipating, we can set a fan in the computer chassis.